Download more information on the NAI PRO-X110 Electronics X-Ray Inspection System to learn about key features and product specifications.

NDT X-Ray Inspection Imaging

The Next Generation in Non-Destructive X-Ray Inspection Imaging

Safe, simple, and smart. Protect your product and brand with NAI’s new X-ray inspection machine. Simple to use with intuitive software and controls, the PRO-X110 is ideal for a wide range of detection applications. Schedule an application analysis to learn more about the benefits for your bottom line.

• Compact/mobile design, easy to move
• Ergonomic and intuitive design – simple operation
• Built NAI tough! Longest warranty in the industry
• Unsurpassed performance at a competitive price
• Customize your cabinetry with your logo and brand design

See the Smallest of Details

NAI’s PRO-X110 X-Ray Inspection Machine has outstanding image quality down to the smallest detail – perfect for all electronics applications. The PRO-X110 offers magnification up to 400X with plenty of tube power to penetrate the most difficult product.

PRO-X110 Key Features

Ergonomics
Compact machine designed to be operated by any size operator. Adjustable operator’s workstation to accommodate all heights.

X-Ray Tube Design
Wide beam sealed tube (no maintenance) which is excellent for angle viewing of the sample. No tilt of the sample is necessary.

X-Ray Tube Specifications
High kV (110kV). High power (20 watt). Small focal spot (5 micron). Short FOD (7mm). A combination of specs that address all of the SMT inspection requirements.

Detector
Digital extreme high-resolution FPD for balanced, high-magnification imaging. Arc motion for all angle viewing. No tilt of the sample necessary.

Sample Load/Unload
Sliding door for easy access to sample area. Sample Table 0-180 degree rotating table to effectively generate multiple viewing positions.

Sample Table
0-180 degree rotating table to effectively generate multiple viewing positions.

Image Programming
Pro-X Auto Image Creation. Create image libraries by clicking just one button. Saves kV, mA, magnification settings, X/Y position and tilt angle.

Service/Maintenance
Open internal design for easy access to ALL critical areas of the machine.

Mobile
The machine is small and mobile. Easy to move from location to location.

Price/Performance
Less than $80,000 for a high-powered, high-performance X-ray solution.

Image Processing Software

Vital to quality control, NAI software allows manufacturers to find contamination, scratches, cracks, blemishes, gaps, pits and other production flaws. Post-processing software can detect defects invisible to the human eye – faster and more accurately.

We offer several user-friendly software packages to meet a variety of applications for a wide range of industries. Choose from one of our three software packages or let us put together a customized package to fit your unique needs.

Standard Software

• Image capturing and saving (.jpg, .bmp, .tif)
• Auto Live image averaging
• Post capture image enhancements:
  • Brightness and contrast adjustments
  • Image filters (sharpen, pseudo color, negative)
• Point-to-point distance measurement tool
• Measurement calibration (inches, mm, mils)
• Image annotation tool:
  • On-screen text tool
  • Arrow drawing
  • Line, circular or rectangular shape drawing
• Quad view imaging tool
  (allows user to capture four
  images and combine them
  into one picture)

Optimum Software

• All features from the Standard Software
• BGA measurement algorithm tools
• Solder ball size:
  • Ball area
  • Ball diameter
  • Ball roundness
  • Percent voice
  • Pass fail criteria
  • Image reporting

Advanced Software

• All features from the Standard and Optimum
• QFN measurement algorithm tools:
  • Joint area
  • Percent void
  • Pass/fail criteria
• Semiconductor measurement algorithm tools:
  • Bond wire sweep
  • Die attach void measurement
  • Pass/fail criteria
• Gull wing joint measurement algorithm tools:
  • Joint area
  • Percent void
  • Pass/fail criteria
  • Drill offset measurement
  • Center to center offset(X & Y distance)